The Universal-S300 is a 12-inch CMP equipment developed by Hwatsing to meet industry-leading demands, integrating advanced polish-processes, high efficiency, and exceptional stability. This tool is equipped a stacked layout architecture to achieve high production capacity within limited machine space, equipped with an efficient transport and clean-system. Its modular design accommodates diverse customer requirements for different processes, meeting the growing need for enhanced cleanliness. The Universal-S300 enables superior global nanoscale planarization of wafers, fulfilling the requirements of advanced process technologies and enabling mass application in manufacturing processes such as integrated circuits and advanced packaging.
Universal-H300 is a 12-inch CMP equipment developed by Hwatsing to meet the leading-edge demands of the industry. It integrates advanced polishing technology, high efficiency and high stability. This equipment adopts an innovative polishing system architecture, which can significantly enhance polishing efficiency. It is equipped with more advanced cleaning technology to meet the increasingly demanding cleanliness requirements. It can better achieve global planarization of wafers at the nanometer level, meeting the needs of advanced process technologies. It has been widely applied in manufacturing processes such as integrated circuits, advanced packaging, and large silicon wafers.
Universal-300FS is a 12-inch CMP equipment innovatively developed by Hwatsing to meet the the leading-edge demands of the industry, integrating advanced cleaning processes, high efficiency and high stability. The equipment is equipped with diverse advanced cleaning technologies, superior polishing units, Integrates with multiple endpoint detection technologies, demonstrating superior comprehensive performance. It can better achieve global planarization of wafers at the nanometer level, meeting the needs of advanced logic process technologies, and is widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon chips,etc.
The Universal-300 T is a leading 12-inch CMP equipment developed based on the advanced CMP equipment of Hwatsing and according to the industry's cutting-edge technology requirements. The equipment is based on the innovative technology of the independent intellectual property rights of Hwatsing, equipped with polishing units with superior performance, integrated with a variety of endpoint detection technologies, and equipped with more advanced combined cleaning technology, showing a better cleaning effect. This equipment can realize the global flattening of wafer at nanometer level, meet the requirements of advanced manufacturing technology, and is widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon chips, etc.
The Universal-300 X is an advanced 12-inch CMP device developed for the current high-end market. The equipment uses Hwatsing's innovative technology with independent intellectual property rights, is equipped with superior performance polishing and cleaning units, and integrates a variety of advanced endpoint detection technologies. The equipment is efficient and stable, and the process combination is flexible, which can realize the global flattening of the wafer at the nanometer level, meet the needs of advanced manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
The Universal-300 Dual is a mature 12-inch CMP device developed based on the innovative technology of Hwatsing's independent intellectual property rights. The equipment is equipped with multiple sets of polishing units and cleaning units with superior performance, integrates a variety of advanced end-point detection technologies, and has excellent process adjustability and stability. It can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafers and other manufacturing processes.
The Universal-300 E is a mature 12-inch CMP device developed for the mid-to-high end market. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, integrated with a variety of advanced endpoint detection technology. The device has excellent process stability and high production efficiency, can achieve ultra-high wafer surface flatness, meet the needs of mature process technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
The Universal-300 B is a 12-inch CMP device based on innovative technology developed by Hwatsing with independent intellectual property rights. The device is equipped with superior performance polishing units, compatible with 4/6/8/12 inch wafers, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has a small footprint, high cost performance advantages, can meet the needs of mature process technology, widely used in silicon wafer, third generation semiconductor, MEMS and other manufacturing processes.
The Universal-TGS200 is a chemical mechanical polishing system specifically engineered for third-generation semiconductor materials (SiC). It is equipped with three polishing modules based on a single-platen double-head design, and integrates post-cleaning modules, enabling double-sided wafer polishing. It features a high level of automation and high processing efficiency. It is suitable for the fabrication of silicon carbide (SiC) substrates, the verification of the performance of polishing consumables, the development of advanced CMP process, and other fields of third-generation semiconductor materials.
Universal-200 Smart is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, high output, stable performance, flexible process combination, can achieve ultra-high flatness of wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, silicon wafers, third-generation semiconductors, MEMS, Micro LED and other manufacturing processes.
Universal-200 is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing units with superior performance, compatible with 4/6/8/inch wafers, suitable for a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in silicon wafers, third-generation semiconductors, MEMS and other manufacturing processes.
Universal-200 D is a mature 8-inch CMP device developed on the basis of innovative technology with independent intellectual property rights of Hwatsing. The equipment is equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, applicable to a variety of materials, can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in manufacturing processes such as silicon wafers, third-generation semiconductors, MEMS, Micro LED, etc.
The Universal-150 Smart is a mature 6-inch CMP device developed according to the current market requirements. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, compatible with 6/8 inch wafer, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has the advantages of flexible process matching and high yield, to meet the needs of mature process technology, widely used in the third generation semiconductor, MEMS and other manufacturing processes.
The Master-P310APEX polishing equipment is a high-precision polishing solution designed for panel-level products in advanced packaging, glass substrate, and other related fields. Specifically engineered to meet the ultra-planarization and low-defect polishing requirements of 310mm × 310mm panels, the system features a dual-polishing-head and dual-platen configuration. It integrates an in-line cleaning module and a fully automatic loading/unloading system, and is equipped with a flip module to enable double-sided polishing. The equipment supports continuous and stable operation, fully meeting the demands of high-volume automated production.
The Master-P510 polishing equipment is a high-precision polishing device for panel-level products in fields such as advanced packaging and glass substrates, specifically designed to meet the ultra-planarization and low-defect polishing requirements of panels with dimensions not exceeding 510mm×515mm. Featuring a single polishing head and a single platen, it boasts low maintenance costs, flexible process switching, and no need for complex supporting facilities.
The Master-P510APEX polishing equipment is a high-precision polishing device for panel-level products in fields such as advanced packaging and glass substrates, specifically designed to meet the ultra-planarization and low-defect polishing requirements of 510mm×515mm panels. Equipped with dual polishing heads and dual grinding plates, it integrates an online cleaning module, a fully automatic loading/unloading system and a flipping module to fulfill double-side polishing needs. Capable of continuous and stable operation, it meets the requirements of fully automated mass production.
iPUMA-LE is a 12-inch high-current ion implanter with horizontal ribbon beam developed by Hwatsing, which has evolved the beam from a mature vertical ribbon beam in accordance with the requirements of advanced industry technologies. The equipment uses advanced beam gradient technology. It intergrates magnetic field and electric field modules?,and it is equipped with precise measurement technology, demonstrating excellent ion selectivity capability and accuracy? to meet the demands of various process technologies. The equipment has been applied in semiconductor manufacture.
iPUMA-HT is a 12-inch hot ion implanter developed from a mature high current implanter by Hwatsing, under the requirements of advanced device technologies. The implanter is equipped with hot temperature module, temperature detection unit and cooling package to meet the demands of advanced process technologies. The equipment has been applied in semiconductor manufacture such as advanced logic device.
iPUMA-HP is a 12-inch hydrogen high-current ion implanter developed from a mature high current implanter by Hwatsing. The implanter is equippped with good particle selectivity and cooling module to meet the requirement of particle number and temperature control in the process flow of layer transfer technology.It could increase the productivity by hardware upgrade. The equipment has been applied in wafer maker manufacture.
iPUMA-LT is a 12-inch cold ion implanter developed from a mature high current implanter by Hwatsing, under the requirements of mature device technologies. The implanter is equipped with cryogenic operating module, temperature detection unit and temperature warm-up module to meet the demands of mature process technologies.
The iHQ-900E is a medium-current ion implanter introduced by Hwatsing for advanced process nodes. This equipment features exceptional ion beam angle accuracy and beam shape control capabilities, ensuring highly precise dose uniformity across wafers with stable performance. The system employs an advanced three-magnet architecture, delivering industry-leading high-cleanliness beamline conditions. The iHQ-900E is compatible with a wide range of high-end chip manufacturing scenarios: for FinFET logic devices, it enables more precise critical angle control; for memory chip mass production processes such as DRAM and 3D NAND, it reduces per-wafer manufacturing costs; and with its superior metal contamination performance, it meets the stringent manufacturing requirements of CMOS image sensors. Equipped with a high-temperature implantation process module, it also fulfills the doping requirements for SiC power device fabrication. The iHQ-900E is a core and critical equipment that drives Moore's Law advancement and accelerates the large-scale commercialization of the third-generation semiconductor industry.
The Versatile-GN200 is a high-rigidity and high-precision wafer grinder. Developed for the power semiconductor device . Adopting a novel layout, this equipment supports grinding on wafers of various material including Si, SiC, LiTaO?, and LiNbO?. Compatible with 4/6/8-inch wafers,Capable of integrated, it achieves fully automated processing including precise positioning, precision thinning, and double-sided cleaning/drying in a single workflow. Leveraging high-precision online measurement and exceptional surface profile control technology, the equipment achieves high-precision thinning, accommodating the ultra-precision wafer thinning requirements of the power semiconductor device.
A fully automatic edge-retaining wafer grinder compatible with 6/8-inch wafers, specifically developed for power semiconductor applications. Equipped with advanced edge-preservation gringding technology, it ensures superior mechanical strength after gringding, effectively preventing edge chipping and minimizing wafer warpage risks
Versatile-GP300 is an advanced 12-inch ultra-precision wafer grinding equipment developed according to the current high-end market demand of 3D IC manufacturing, advanced packaging and so on. The equipment integrates advanced ultra-precision grinding, CMP and post-cleaning technology through the innovative layout of the new complete machine, and is equipped with excellent thickness deviation and surface defect control technology. It can provide a variety of system function expansion options, with the advantages of high precision, high rigidity, and flexible process development. Versatile-GP300 can flexibly expand and develop a variety of configurations, which greatly meets the needs of ultra-precision wafer thinning technology in 3D IC manufacturing, advanced packaging and other fields.
Versatile-GM300 is an ultra-precision wafer grinding device innovatively developed for the packaging field. Featuring a compact layout, it supports both 8-inch and 12-inch wafers.It enables ultra?precision backside wafer grinding with stress relief and can be integrated with a wafer mounter as an inline system. The fully automated process covers precision thinning, cleaning and drying, tape-ring attachment, and back-tape detaping.The highly reliable wafer handling system effectively reduces the risk of thin-wafer breakage.Offering fine grinding (Finigrind),dry polishing and wet polishing(CMP) methods for stress removal,Versatile-GM300 delivers high precision, high rigidity, and exceptional process flexibility across a wide range of applications, fully meeting the demanding requirements of thin-wafer processing in the packaging field.
Versatile?GM300HC is a fully?automatic grind?polish?mounter integrated system developed for the advanced packaging field.Focused on full?sequence requirements for wafer back?side thinning, the equipment enables integrated processing of wafer back?side grinding, polishing, and tape mounting / detaping. It adopts separate?chamber operation for coarse polishing and fine polishing, and integrates a high?purity wet cleaning module, which greatly improves wafer cleanliness in standalone mode.The system supports both 8?inch and 12?inch wafer processing and offers two transfer configurations—clamping and vacuum chuck—to accommodate diverse process development needs in emerging fields such as advanced packaging and MEMS.
Versatile-GH300 is a new generation 12-inch ultra-precision wafer grinding equipment developed according to the current high-end market demand of 3D IC manufacturing,advanced packaging and so on.The equipment achieves fully automated ultra-precision grinding, stress removal, and cleaning-drying through an innovative overall machine layout, optimized high rigidity structural design, and integration of advanced ultra-precision grinding, precision control, and post-cleaning technologies.Relying on advanced thickness uniformity and surface defect control technology, it can achieve excellent TTV performance, effectively meeting the stringent process requirements for flatness and consistency of ultra-thin wafers and advanced packaging; at the same time, through efficient grinding cycles and stable process integration, it has a high WPH production capacity, balancing processing precision and production efficiency. The equipment can be flexibly expanded according to actual needs, with the development of various configurations,It greatly satisfies the technical requirements for ultra-precision thinning for wafers in fields such as 3D IC manufacturing and advanced packaging.
Versatile-GR300 is a fully automatic edge-retaining grinding machine independently developed by Hwatsing for the power semiconductor . It enables end-to-end automated operation. The equipment is highly compatible, supporting 8-inch and 12-inch wafers（8-inch are supported by an optional accessory）. It also incorporates advanced edge-retaining grinding technology, which allows the wafer to retain greater bend resistance after thinning. This not only eliminates edge chipping during wafer thinning but also significantly reduces wafer warpage risk.
Versatile-GB310 is an automatic large-format Panel precision thinning machine independently developed by Hwatsing , targeting advanced board-level and panel-level packaging processes such as Fan-out, 2.5D/3D packaging, high-density substrates, and display panels, filling the gap in domestic mass-production equipment for large-board precision grinding. It accommodates a wide range of large-format, flexible, and brittle panels, including resin substrates, ultra-large PCB boards, display panels, and optical glass panels, supporting high-precision controlled material removal, uniform thinning, and low-damage processing. Through a fully automated material handling system and closed-loop process control, the equipment enables fully unattended operation covering loading, high-precision alignment, controlled grinding and thinning, double-side cleaning, and air-drying unloading. Leveraging a proprietary high-precision grinding algorithm and a high-rigidity machine structure, it delivers excellent full-area thickness uniformity control and ultra-low surface roughness, effectively suppressing common issues in large-panel grinding such as warpage, deformation, thickness deviation, edge chipping, and subsurface damage, thereby significantly improving the yield and consistency of ultra-thin substrate processing. The equipment also supports rapid switching of process recipes according to material hardness, target thinning amount, and precision level, accommodating multi-variety mixed-line mass production; a single unit can cover multiple panel thinning scenarios, notably reducing equipment investment, floor space, and maintenance costs. It provides core equipment support for the large-scale production of advanced processes such as high-end board-level packaging, heterogeneous integration, and ultra-thin substrate fabrication, contributing to the self-sufficiency and domestic upgrading of packaging and testing production lines.
Master-BN300 is a 12-inch wafer bevel precision polishing equipment developed based on cutting-edge industry requirements. This device integrates high-precision polishing, efficient cleaning, and precise measurement functions, adopts modular design, and is compatible with the needs of various processes and application fields. It can significantly improve the smoothness of wafer bevel, meet the technical requirements for high-precision bevel processing in the semiconductor manufacturing field, and has been applied in key processes such as storage chips and advanced packaging.
Master-BT300 is a 12 inch wafer edge precision polishing and trimming equipment developed based on advanced packaging requirements. It is used to solve problems such as wafer edge chipping, burrs, and to trim wafers. This equipment integrates high-precision polishing, trimming, efficient cleaning, and precise measurement functions. It adopts a modular design that can flexibly configure functions to meet the requirements of wafer edge polishing and trimming in advanced packaging fields such as HBM.
Versatile-DT300 is a high efficient and high clean fully automatic dual spindle wafer edge trimming equipment launched by Hwatsing. It is used to accurately solve the problem of edge chipping and breakage during wafer thinning and improve thinning quality. This equipment integrates multiple units such as cutting, transmission, cleaning, and measurement, and is equipped with multi-axis linkage high-precision cutting technology, fully automatic transmission, and high cleanliness cleaning technology. It is also equipped with high-resolution visual alignment and advanced measurement system. Versatile-DT300 has the advantages of high performance, compact size, flexible process, multi-mode combination, and multi-functional configuration, which greatly meets the technical needs of various wafer manufacturing processes and products such as Memory Chips, CMOS Image sensors, and Advanced packaging.
Versatile-DT300D is a fully automatic, dual-stage wafer edge trimming system designed for advanced memory and packaging applications, Its compact footprint is purpose-built for space-constrained cleanroom environments, delivering maximum throughput per unit area. Building on the proven Versatile-DT300 platform, it innovatively introduces a dual-stage system architecture that breaks through the efficiency bottleneck in cutting and metrology. While maintaining the same equipment footprint, it integrates cutting, wafer transfer, cleaning, and metrology into one system, significantly boosting WPH (Wafers Per Hour). Equipped with a multi-axis synchronized high-precision cutting module and a high-resolution visual metrology system, it precisely resolves edge chipping and subsurface cracks after wafer thinning, fully meeting the manufacturing requirements for DRAM, HBM, advanced packaging, and beyond.
Versatile-DC300 is a dedicated fully automated ring cutting system engineered for 12-inch wafers after backside thinning with ring retention. Targeting critical pain points such as wafer cracking and inconsistent ring removal in thin-wafer processing, Versatile-DC300 integrates a fully automated ring removal mechanism with drop detection — enabling precise identification and immediate alerting of pick-up anomalies. An inline UV debonding module completes debonding in one seamless step. The cutting system features an automatic blade dressing unit to maintain optimal blade sharpness, paired with real-time blade breakage detection that triggers an immediate protective shutdown upon anomaly identification — eliminating batch-level cutting defects at the source. Downstream, fully automated wafer transfer links seamlessly to cleaning and spin-drying stations, ensuring contactless, contamination-free wafer handling post ring cutting. With its fully automated, high-reliability, and mistake-proof design, Versatile-DC300 delivers a safe and efficient end-to-end solution for 12-inch thin-wafer ring cutting processes.
Versatile-DT150 is a high-performance, fully automated edge trimming system engineered for 4-inch (100mm) and 6-inch (150mm) wafers.The core dicing system supports both flat and round wafer profiles, with an adaptive algorithm that precisely handles complex contour transitions to ensure edge trimming consistency across non-standard geometries. A high-resolution visual alignment module enables inline closed-loop metrology with real-time feedback, closing the loop between cutting and quality control within a single station. The fully automated wafer handling system offers flexible multi-size compatibility with precise, reliable transfer control — significantly reducing wafer breakage risk and manual intervention. With its high-efficiency, compact, and precision-driven design, Versatile-DT150 delivers a turnkey edge trimming solution for small- to mid-size wafer manufacturing.
Versatile-DT200 is a high-efficiency, high-cleanliness fully automatic dual-wafer edge trimming equipment independently developed by Hwatsing. It is designed to precisely solve edge chipping during wafer thinning, thereby improving thinning quality.Versatile-DT200 combines cutting, transfer, cleaning, and measurement functions. It features multi-axis high-precision cutting technology, fully automatic transfer, high-cleanliness technology, and is equipped with high-resolution visual alignment and advanced measurement systems. Additionally, the equipment offers flexible size switching, diverse process options, and versatile functional configurations, making it highly suitable for advanced packaging, Micro LED, compound wafer, and other semiconductor manufacturing processes and products.
The HPC-F3400 is a single-wafer cleaning system developed by Huahai Qingke to meet the advanced packaging industry's cutting-edge process requirements. Integrating diverse advanced chemical and physical cleaning technologies, this equipment delivers high throughput and excellent process stability. Featuring a stacked chamber design, it incorporates a frame-ring protection mechanism in the process chamber and combines multiple cleaning methods—including chemical immersion, chemical spray, megasonic cleaning, Nanospray cleaning, and brush scrubbing. With its modular architecture, the system can be flexibly configured according to customers' specific process needs, continuously meeting the increasingly stringent wafer surface cleanliness requirements of advanced packaging and supporting mass production for various advanced packaging manufacturing processes.
The HSC-D3812 is a next-generation single-wafer cleaning platform developed by Hwatsing for advanced process node. Featuring a dual-layer isolated architecture, advanced multi-chemical processing capability, and exceptional scalability of up to 20 chambers, it delivers throughput of up to 1,000 WPH, providing customers with a new standard in high-efficiency wafer cleaning solutions.
HSC-F3400 is a high-performance equipment developed by Hwatsing for the special needs of the large silicon wafer final clean market. It features excellent particle and metal contamination control systems, innovative cleaning and drying modules, and high-performance chuck holding technology.
HSC-F2400 is applied to final cleaning of 4/6/8-inch compound semiconductor materials respectively. The equipment is based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior performance single cleaner module and double-sided brushing module, integrating a variety of chemical liquids, and equipped with advanced physical cleaning methods to show more excellent cleaning effect. The equipment meets the needs of a wide range of compound semiconductor materials and has been applied in bulk in the compound semiconductor field.
HSC-I2402 is applied to pre cleaning of 4/6/8-inch compound semiconductor materials respectively. The equipment is based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior performance single cleaner module and double-sided brushing module, integrating a variety of chemical liquids, and equipped with advanced physical cleaning methods to show more excellent cleaning effect. The equipment meets the needs of a wide range of compound semiconductor materials and has been applied in bulk in the compound semiconductor field.
HSC-S1300 is a brush clean system mainly used in 4/6/8-inch compound semiconductors developed by Hwatsing for market demand,it features front and back scrubs and integrates superior cleaning and drying technology. In addition, it’s also compatible with acid solution cleaning/alkaline solution cleaning, transparent/opaque chip cleaning.
HSC-S3810 is a brush clean system developed according to the industry's cutting-edge technology, it’s based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior parameter closed-loop control system, it also has front, back and edge cleaning functions, and can achieve damage free cleaning. HSC-S3810 covers an area of small, high output.
HCC-3080S is a clean system for 4/6/8/12-inch wafer container, it adopts Hwatsing's innovative technology, equipped with superior performance water recovery device, its unique two-door design enables independent loading and removal of the cassettes before and after cleaning, with the advantages of high environmental protection and low consumption.
HBC-E3500 is a wet Bench clean system independently developed by Hwatsing based on market development frontier and customer demand ，With strong compatibility, support a variety of process formula mixed operation. It adopts customized, modular design and flexible configuration to meet the process requirements of different customers.
HSDS series grinding fluid supply system adopts modular design, customization, flexible configuration, online proportioning system with real-time, high precision, which can realize parameters such as concentration, flow, pressure closed loop control, meet the semiconductor manufacturing process of wet process equipment such as grinding fluid supply demand, convenient operation and maintenance, high reliability, safety and low maintenance cost, flexible configuration, etc.
HCDS series chemical supply system, adopting modular design, customization, flexible configuration, online proportioning system with real-time, high precision, which can realize closed loop control parameters, meet the wet process equipment in the process of semiconductor manufacturing chemicals such as cleaning fluid supply demand, convenient operation and maintenance, high reliability, safety and low maintenance cost, flexible configuration, etc.
Hwatsing has a standard wafer reclaim production workshop, a professional CMP/Wet technology team, and comprehensive measurement and analysis instruments.Its measurement equipment already covers all mainstream metrology tools.The company provides full-range technical support, sales, and foundry services tailored to different process requirements, delivering high?quality services to over 30 domestic partners.The current Tianjin fab has a monthly capacity of 200,000 pieces of 12?inch reclaimed wafers. Upon completion of the second fab in Kunshan, an additional monthly capacity of 400,000 pieces will be added. Once operational, Hwatsing will become the leading reclaimed wafer manufacturer in China by output.
Key consumables and maintenance services mainly provide customers with maintenance and update services for key consumables of CMP equipment. Hwatsing has a team of process experts with years of experience in large-scale production lines, dedicated to providing customers with complete solutions. The company's independently controllable and highly stable supply chain system ensures the stable operation of the equipment.
Hwatsing Technology Co., Ltd. (Stock Code: 688120) is a high-end semiconductor equipment manufacturer with core independent intellectual property rights. The company’s main products include Chemical Mechanical Polisher, Implanter, Grinder, Bevel Polisher, Dicer, Wet Process Equipment, Wafer Reclaim, Consumables and Maintenance Service, and form the platform strategy of "equipment + service". The company's main products and services have been widely used in integrated circuits, advanced packaging, large silicon wafers, third-generation semiconductor, MEMS ，Micro LED and other manufacturing processes.
